FOLYSKY（WuHan） LTD.
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FOLYSKY（WuHan） LTD.
transducer, the English name transducer, is a detection device that can feel the information being measured, and can transform the felt information into an electrical signal or other required form of information output according to a certain law to meet the requirements of information transmission, processing, storage, display, recording and control.
According to the manufacturing process to classify:
Integrated sensors are manufactured using standard process techniques for the production of silicon-based semiconductor integrated circuits. Usually, part of the circuit used for the initial processing of the signal under test is also integrated on the same chip, such as the MEMS sensor that is now vigorously developed.
Thin film sensors are formed by depositing a thin film of the corresponding sensitive material on a dielectric substrate (substrate). When the hybrid process is used, part of the circuit can also be manufactured on this substrate.
The thick film sensor is made of a slurry of the corresponding material coated on a ceramic substrate, which is usually made of Al2O3, and then heat treated to form the thick film.
Ceramic sensors are produced by standard ceramic processes or some variant of them (sol, gel, etc.). After the appropriate preparatory operation is completed, the formed components are sintered at high temperatures.
There are many common characteristics between the two processes of thick film and ceramic sensor, and in some respects, the thick film process can be considered as a variant of the ceramic process.
Select the sensor from the sensitivity, frequency response, linear range, stability and accuracy of these aspects to consider, which stability and the quality of the base plate has a great relationship, the first few mainly look at the manufacturing process, from the stability of the word, then the most suitable for the sensor non-ceramic packaging substrate. The stability of ceramic materials is quite excellent, as long as the manufacturing process technology can pass, ceramic packaging substrate is undoubtedly much better than other PCB.
However, the current domestic sensor manufacturers are still small and medium-sized, there are still many in the use of thin film process, using FR-4 substrate, the service life is not long, poor stability, encountered a slightly worse environment, it directly struck. To keep up with international standards, sensors still need to work hard.
If the domestic sensor industry wants to update and iterate and make continuous progress, it must not be around a wide range of ceramic packaging substrates, and as far as I know, Silitong ceramic packaging substrates use more new technologies.
1. Higher thermal conductivity: The thermal conductivity of alumina ceramics: 15 ~ 35 W/m·K The thermal conductivity of aluminum nitride ceramics: 170 ~ 230 W/m·k, and the thermal conductivity of copper substrate is 2W/m·K
2. More matched thermal expansion coefficient: the thermal expansion coefficient of ceramics and chips is close to each other, and will not cause too much deformation when the temperature difference changes, resulting in line derwelding, internal stress and other problems!
3. Stronger and lower resistance metal film layer: the combination strength of the metal layer and the ceramic substrate on the product is high, the electrical conductivity of the metal layer is good, and the heat is small when the current passes through;
4. Good insulation: breakdown resistance voltage up to 20KV/mm;
5. The thickness of the conductive layer is customized within 1μm ~ 1mm: the copper thickness can be customized, and the contribution to MEMS is not small.
6. Low high-frequency loss, high frequency circuit can be designed and assembled; The dielectric constant is small,
7. Can be high-density assembly, line/pitch (L/S) resolution can reach 20μm, so as to achieve short, small, light, thin equipment;
In addition to the above characteristics, the ceramic packaging substrate of Slitong also has no organic components, long service life, the copper layer does not contain oxidation layer, can be used in the reducing atmosphere for a long time, and even can do three wirelessly, three-dimensional vertical wiring.
In the final analysis, the sensor still needs ceramic packaging substrate, currently in developed countries have been widely used, China is really not the technology restricts the development of the sensor circuit board replacement, but also to see the major manufacturers, Goer, Dahua these Chinese leaders play a leading role, manufacturers carry out technological innovation, in order to become bigger and stronger, China's sensor industry can also catch up with the pace of the world.
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