Comparative analysis of four power type packaging substrates

2020-06-10 09:45:14

As the carrier of heat and air convection, the thermal conductivity of power package substrate plays a decisive role in heat dissipation. DPC ceramic substrate with its excellent performance and gradually reduced price, in many electronic packaging materi

Research on the application of silicon nitride substrate to IGBT module

2020-06-10 09:44:29

Insulated-gate bipolar transistor (IGBT) is the most advanced power electronic device to realize electric energy conversion and control, which is widely used in electric vehicles, electric locomotives, smart grid and other fields.

Sliton DPC silicon nitride substrate

2020-05-10 09:43:42

Direct copper-clad substrates are suitable for high power applications (high current/high voltage) where excellent heat dissipation performance is often required. The main challenge is how to balance the miniaturization of chips with increasing power. Sli

Ceramic packaging substrate will become the new air outlet of the Internet of Things

2020-05-10 09:42:57

The Internet of Things has been hyped up lately, so what exactly is the Internet of Things? The Internet of Things operates on the basis of the Internet, using the Internet to connect things, analyze data through the Internet, and then give a reasonable p

What kind of packaging substrate does the sensor need

2020-04-10 09:41:52

transducer, the English name transducer, is a detection device that can feel the information being measured, and can transform the felt information into an electrical signal or other required form of information output according to a certain law to meet t

Silicon carbide substrate - a new power for the development of automotive electronics

2020-04-10 09:41:19

With the development of scientific and technological innovation, automotive electronics have become the most important supporting basis for automotive control systems. The electrification of the automobile marked the beginning of the revolution in the aut