Substrate type: alumina

Number of layers: double-sided

Thickness: 0.50mm

Size: 3.5X3.5MM (single)

Board copper thickness: 35um

Copper thickness inside the hole: 30um

Line width and distance: 0.2/0.15mm

Minimum aperture: 0.15mm

Surface treatment: nickel and palladium precipitation

Special process: metallized half hole