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Semiconductor refrigeration sheets - Aluminum oxide copper clad sheets - Double sided - Deposited nickel palladium

Substrate type: alumina


Number of layers: double-sided


Thickness: 0.25mm


Size: 2.2X3MM (single)


Plate thickness copper: 18um


Copper thickness inside the hole:/


Line width and distance: 0.2/0.1mm


Minimum aperture:/


Surface treatment: nickel and palladium precipitation


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contacts:Mr. Hu
E-mail:market@folysky.com
cell phone:13387504731
Company address:Jiangxia District, Wuhan City

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