Ceramic drilling

1. Material: ①. 96% alumina ceramic ②. 99% aluminum nitride ceramic ③. Sapphire ④. High borosilicate glass 2 conductor process: DPC (direct copper plating) 0.1-10oz; LAM (Laser Attached Copper) 0.1-10oz 3. Performance: Copper bonding force (N/cm2):

Ceramic Metallization DPC Technology

Thin film method is the main method for metal film deposition in microelectronics manufacturing, with direct plating copper being the most representative.