Alumina side metallized ceramic circuit board

Special type: side metallization Base material thickness: 0.38mm Conductive layer: copper nickel palladium Metal layer thickness: 30um Surface treatment: deposited nickel gold Metal single/double sided: double sided

Aluminum oxide blind slot circuit board

Special type: blind slot design Base material thickness: 0.5mm Conductive layer: copper nickel palladium Metal layer thickness: 30 μ M/20 μ M Surface treatment: nickel palladium Metal single/double sided: double sided

Aluminum oxide ceramic cooling sheet copper clad plate

Base material type: aluminum nitride ceramic Base material thickness: 0.38mm Metal layer thickness: 350 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: double sided Through hole: None

99% alumina ceramic circuit board

Substrate type: 99% alumina ceramic circuit board Base material thickness: 1.0mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 300 μ M Surface treatment: nickel palladium Metal single/double si

99.6% alumina ceramic circuit board

Base material type: 99.6% alumina ceramic Base material thickness: 2.0mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 70um+200 μ M Surface treatment: nickel palladium Metal single/double sided

96% alumina ceramic circuit board

Base material type: 96% alumina ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal layer thickness: 65 μ M Surface treatment: nickel gold Metal single/double sided: double sided Th