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R & F Technology (Wuhan) Co., Ltd. specializing in the production of ceramic based circuit boards, similar to alumina ceramic base, aluminum nitride ceramic base, zirconia ceramic base, glass, quartz and so on.
The company’s cutting-edge technologies and direct copper plating (DPC) technology.
A national invention patent technology, which can realize large-scale production of single-sided, double-sided and three-dimensional ceramic circuit boards. The product has high precision and good adhesion, and the conductive layer can be customized from 1 m to 1mm according to customer’s requirements. The use of pure copper instead of silver paste can solve the problem of conductivity and adhesion of the hole, and the overall performance is more stable. The process is mature and the performance of the products is excellent. High precision wiring can be achieved by laser incident 3D surfaces. Free from the appearance limit, the design space is more imaginative, the cost is lower than the traditional technology, no mold opening, environmental protection and pollution-free, and the application field is extensive.
Direct copper plating DPC technology, mainly by evaporation and magnetron sputtering deposition process of metal substrate surface, first under vacuum sputtering of titanium, chromium and copper particles is, finally electroplating thickening, followed by photolithography of photoresist coating exposure, development and etching, to complete the film process line making, finally the plating / electroless deposition increases the thickness of the line, to resist removal after metal line production, applicable to the vast majority of ceramic substrate.
(1)Higher thermal conductivities and more matched thermal expansion coefficients;
(2)A conductive metal film with a firmer and lower resistance;
(3)The substrate has good weldability and weldability, and has a wide temperature range;
(5)The thickness of the conductive layer is adjustable from 1 to 1mm to m;
(6)High frequency loss, high frequency circuit design and assembly can be carried out;
(7)High density assembly can be carried out with line / pitch (L/S) resolution of up to 20 m, thus achieving short, small, light and thin equipment;
(8)Free from organic ingredients, resistant to cosmic radiation, high reliability and long service life in aerospace;
(9)The copper layer contains no oxide layer and can be used for a long time in a reductive atmosphere.
(10)D substrate and 3D routing.