Among ceramic substrates, thin films and thick films are well known. The main difference is the metallization technology. The thin film ceramic substrate is usually made by DPC technology; while the thick film ceramic substrate is mostly screen printing technology, and then the conductive paste is directly coated on the ceramic substrate, and the temperature is high. Sintering is performed by firmly adhering a metal layer to a ceramic substrate. Both of these methods have their own characteristics, but the DPC thin film process has a low cost (below 300 ° C), which is very suitable for electronic device packaging that requires high circuit precision. This time, the main point is the application of thin film ceramic substrates in the field of electronic communication.
When it comes to the communications industry, many people are familiar with it, whether it is a smart phone or a mobile network, it is closely related to people’s daily lives. The source, channel, and sink in the communication system are not known to many people. Next, the role of the thin film ceramic substrate in the inside will be explained in detail.
Generally speaking, mobile phones and computers are both a source of information and a destination. They transmit electromagnetic wave signals in air or fiber by wireless or wired means and are finally accepted by the receiving device. In the process of wireless transmission, the signal is weak, which is why the mobile phone is full in a wide area, and the signal is poor in a room or a building. This requires a base station, a signal-like relay station, to keep the signal alive. Whether it is a base station or a mobile phone, the chip needs to receive and transmit signals.
With the vigorous construction of 5G, the "no signal area" can be said to be zero in the future, and the transmission frequency of 5G is more than 100 times higher than 4G. Then in the future communication system, the importance of the chip does not need to be questioned. It must ensure that the electromagnetic wave signal can not be distorted during the process of converting high frequency into electric signal, and such a high frequency electric signal conversion will dissipate heat, and it is necessary to avoid overheating damage of the component.
At this time, the thin film ceramic substrate can solve this problem. The thin film ceramic substrate has a thin film alumina ceramic base and an aluminum nitride ceramic base. They are all made of metallized by DPC technology, which can meet the requirements of miniaturization of mobile phone chip or base station chip, and the circuit precision is more detailed to meet the basic requirements of electrical signal transmission. At the same time, the dielectric constant is small, and the loss of the high-frequency electrical signal is small, thereby avoiding signal distortion. The thermal conductivity of the thin film aluminum oxide and the thin film aluminum nitride ceramic substrate is 15 to 35 W/m.k and 170 to 230 W/m.k, respectively. The base station can divide the macro base station and the micro base station, that is, the radiation range is large or small. Therefore, the macro base station that processes more signals generates more heat, and a thin film AlN ceramic base can be selected; the micro base station can use a thin film Al2O3 ceramic base. In terms of mobile phones, whether it is a wireless network card that transmits and receives signals, or a mobile phone battery and a system chip, or a 3D face recognition sensor, the most suitable one is aluminum nitride ceramic base, which can ensure more functions of the mobile phone. High-intensity heat dissipation.
In the near future, when the communication market is getting bigger and bigger due to the construction of 5G, the thin film ceramic base will always follow, giving the communication market the greatest support!