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DPC Technology

DPC Technology

 Thin film method is the main method of metal film deposition in microelectronic manufacturing, among which direct copper plating (Direct, plating, copper) is the most representative. Direct copper plating (DPC), mainly by evaporation and magnetron sputtering deposition process of metal substrate surface, first under vacuum sputtering of titanium, chromium and copper particles is, finally electroplating thickening, followed by ordinary PCB technology to complete production line, then the chemical plating / deposition increase line thickness.
     The DPC process is suitable for most ceramic substrates. The metal has good crystalline performance, good flatness, easy to fall off line, more accurate line location, smaller wire distance, stable reliability and so on.